Rudolph Technologies NSX® wafer inspection systems offer high throughput along with repeatable macro wafer defect inspection for defects 0.5 micron and larger.
Macro wafer defects can occur at various phases of semiconductor manufacturing, and can have a major impact on the quality of your microelectronic devices. This cost-effective used Rudolph Technologies NSX 105 wafer inspection system quickly and accurately detects critical defects and provides quality assurance in addition to valuable process information.
The NSX 105 wafer inspection system is field proven across a wide range of applications including semiconductor, wafer bumping, MEMS, optoelectronics, micro displays and data storage.
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