The 3100 plus ESEC Wire Bonder offers high acceleration and low vibration and includes a fully ergonomic human-machine interface with a multi-lingual, self-explanatory user-friendly GUI.
Additional features of this fully refurbished ESEC wire bonder:
- Cu Kit
Theta / y-movement TY bondhead
35μm production capability
Enables a wide range of lead frame and organic substrate applications
- Maintenance-free air bearing technology
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