The ESEC 3100 wire bonder has a unique pivoting bond-head, an ergonomic design and multi-lingual GUI, and is a cost leader in wire bonding.
ESEC Wire Bonder Features
ESEC Wire Bonder for Sale - ESEC 3100 Plus
- TY (theta/y-movement) technology that links pivotal to linear motion, enabling high acceleration and low vibration for shorter settling times, high speed and high accuracy
- 35 μm production capability
- Handles a wide range of lead frame and organic substrate applications
- Process modes to support stacked-die applications
- Ergonomic HMI (human-machine interface)
- User-friendly GUI
- Maintenance-free air bearing technology
This ESEC 3100 Wire Bonder is also equipped with 2008 RIC/ROC Reel in/out
Interested in this used ESEC 3100 wire bonder? Please click the button below to request more information or a quote.
Do you have used semiconductor equipment to sell?
Please CONTACT US at one of our three worldwide locations for assistance buying or selling used semiconductor equipment.