ESEC Wire Bonder 3100 plus SC (Code: 654 )

ESEC Wire Bonder
zoom Zoom image
ESEC Wire Bonder ESEC Wire Bonder 3100 plus SC ESEC Wire Bonder 3100 plus SC

The ESEC 3100 wire bonder has a unique pivoting bond-head, an ergonomic design and multi-lingual GUI, and is a cost leader in wire bonding.

ESEC Wire Bonder Features

used esec wire bonderESEC Wire Bonder for Sale - ESEC 3100 Plus 

  • TY (theta/y-movement) technology that links pivotal to linear motion, enabling high acceleration and low vibration for shorter settling times, high speed and high accuracy
  • 35 μm production capability
  • Handles a wide range of lead frame and organic substrate applications
  • Process modes to support stacked-die applications
  • Ergonomic HMI (human-machine interface)
  • User-friendly GUI
  • Maintenance-free air bearing technology

This ESEC 3100 Wire Bonder is also equipped with 2008 RIC/ROC Reel in/out

Interested in this used ESEC 3100 wire bonder? Please click the button below to request more information or a quote. 

Do you have used semiconductor equipment to sell?

Please CONTACT US at one of our three worldwide locations for assistance buying or selling used semiconductor equipment.

Why CMTec?

Manufacturer: ESEC
Ask a question about this Product
Company MAXXmarketing GmbH