ESEC Wire Bonder 3088 (Code: 145)

ESEC Wire Bonder 3088
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ESEC Wire Bonder 3088 ESEC Wire Bonder 3088

The ESEC Wire Bonder 3088 offers ultra fine pitch capability, a wide bond range, high yield and process portability for demanding IC applications. 

ESEC Wire Bonder 3800ESEC Wire Bonder 3088 Features:

  • Maintenance-free Flying Bondhead
  • Dynamic Force Calibration System
  • Off-line programming
  • Wide range of package capability
  • Fully programmable indexer
  • 60 μm fine pitch capability
  • Full process portability - a recipe created on one machine can be used on any other machine without new setup
  • Back handling
  • NO BPS

Interested in this ESEC wire bonder? Please click the button below to request more information or a quote. 

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Manufacturer: ESEC
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Company MAXXmarketing GmbH