The ESEC Wire Bonder 3088 offers ultra fine pitch capability, a wide bond range, high yield and process portability for demanding IC applications.
ESEC Wire Bonder 3088 Features:
- Maintenance-free Flying Bondhead
- Dynamic Force Calibration System
- Wide range of package capability
- Fully programmable indexer
- 60 μm fine pitch capability
- Full process portability - a recipe created on one machine can be used on any other machine without new setup
- Back handling
- NO BPS
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