The Royce 650 Universal Bond Tester offers robust capabilities from the full range of standard test applications through custom testing.
Royce Pull & Shear Tester Features
- A wide range of applications including wire pull, ball bond shear, die shear, solder ball (bump) shear, zone shear, tweezer pull, stud pull, die strength 3-point bend (push) test, heated testing, and custom testing to user specifications
- Motor-driven microscope with one-button height adjustment
Easily accommodates up to 300-mm wafers and substrates, lead frames and large electronic modules with X-axis travel over 300 mm and Y-axis travel over 150 mm of the servo driven XY stage
High magnification and wide-zoom-range image capture
Interchangeable test modules and tooling
- Ergonomic Design
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