ESEC 2008 die bonders offers accuracy, productivity, process security and total process control to ensure high quality bonding.
Key features of this fully refurbished die bonder from ESEC:
- Integrated camera for the pick and bond process
- Syncrhonized needle and bondhead movement
- Easy setup
- Die attach process is monitored and controlled with up to 5 configurable functions on 3 camera systems
- Optical Dispense Centering (ODC)
- Prebond/Postbond IQC
- Programmable indexer for wide substrates
- Able to process a various types of substrates and leadframes
- Fast and Flexible Programmable Dispenser (FPD) for superior epoxy dispensing
- DINP, WMP
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