ESEC Die Bonder 2008HL3 (Code: 223)

ESEC Die Bonder 2008HL3
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ESEC Die Bonder 2008HL3 ESEC Die Bonder 2008HL3

ESEC 2008 die bonders offers accuracy, productivity, process security and total process control to ensure high quality bonding.

Key features of this fully refurbished die bonder from ESEC:

  • Integrated camera for the pick and bond processUsed ESEC Die Bonder for sale
  • Syncrhonized needle and bondhead movement
  • Easy setup
  • Die attach process is monitored and controlled with up to 5 configurable functions on 3 camera systems
  • Optical Dispense Centering (ODC)
  • Prebond/Postbond IQC
  • Programmable indexer for wide substrates
  • Able to process a various types of substrates and leadframes
  • Fast and Flexible Programmable Dispenser (FPD) for superior epoxy dispensing
  • DINP, WMP

Interested in this used die bonder? Please click the button below to request more information or a quote. 

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Manufacturer: ESEC
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Company MAXXmarketing GmbH