Refurbished ESEC Die Bonder 2008 xP (Code: 761)

Refurbished ESEC Die Bonder 2008 xP
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Refurbished ESEC Die Bonder 2008 xP Refurbished ESEC Die Bonder 2008 xP

The ESEC Die Bonder 2008 xP is an expandable platform for high speed to high end applications.

Refurbished ESEC die bonder 2008 Key features

  • Refurbised ESEC Die Bonder 2008 xP for saleFlexible production
    • SOIC up to singulated BGA and more
    • 8 mil up to 1" die
    • extra wide bond range
  • High productivity
    • UPH up to 8000 for matrix leadframes (w/o OBC, ODC)
  • Excellent performance
    • Programmable pick and bondforce, synchronized pickup process
    • Programmable showerhead dispenserr, fast programmable dispenser
    • Integrated quality control before and after bonding
    • Optical centering systems

Interested in this refurbished ESEC die bonder? Please click the button below to request more information or a quote. 

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Manufacturer: ESEC
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Company MAXXmarketing GmbH