The ESEC Die Bonder 2008 xP is an expandable platform for high speed to high end applications.
Refurbished ESEC die bonder 2008 Key features
- Flexible production
- SOIC up to singulated BGA and more
- 8 mil up to 1" die
- extra wide bond range
- High productivity
- UPH up to 8000 for matrix leadframes (w/o OBC, ODC)
- Excellent performance
- Programmable pick and bondforce, synchronized pickup process
- Programmable showerhead dispenserr, fast programmable dispenser
- Integrated quality control before and after bonding
- Optical centering systems
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