The HS3plus is an advanced ESEC DIE Bonder providing high accuracy at high speed.
ESEC DIE Bonder HS3plus
This used die bonder handles 0.5 mm up to 5 mm dies with a placement accuracy of 37.5μm@3σ.
- Programmable Showerhead Dispenser (PSD3)
- High Performance Pick & Place (hSPP)
- Constant Force Bond Head (CFBH)
- Pick Vision (PVM)
- Manual Quality Control TV (QCTV5)
- Programmable flexible Indexer (xPI)
- Programmable Pneumatic Dispenser
- Optical Dispense Centering
Optical Dispense Centring 2 (ODC2)
- Fast Vision CCD VGA Camera
- Motorized Zoom and Focus
- Diffuse Direct LED Illumination and Indirect LED Illumination
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